寧波芯健半導體有限公司
地址:寧波杭州灣新區庵東工業園區華興地塊中橫路18號
郵編:315327
郵箱:sales@chipex.cn
電話:(86)-574-63078606;
(86)-574-63078608-8858
利用晶圓級封裝技術(WLCSP)制作TVS器件,可使器件尺寸大大縮小,并且電性能和可靠性得到顯著提高,封裝周期短和成本低,已廣泛應用與手機、MP3播放器、PDA和數碼相機等便攜式電子產品提供保護和提高其可靠性。
ltem | Standard | Other |
Die Size Without Dicing Street | 570x270um | NA |
Dicing Street | 60um | No metal allowed in the dicing street |
Bump pitch | 400um within | Follow customer requirement |
Bump Size | 120X210um | Follow customer requirement |
Bump Height | 11um(Cu 8um+Sn 3um) | Only Bake and no feflow allowed |
BG Thickness | 265um | Follow customer requirement |