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            Technology

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            Contact us

            NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

            Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

            P.O:315327

            Mail:sales@chipex.cn

            Tel:(86)-574-63078606;

                      (86)-574-63078608-8858


            0201技術

            Current Location: Home >> Technology >> 0201

                  Making TVS devices by using Wafer-Level Packaging technology can obviously reduce device size and significantly improve electrical performance and reliability, shorten the package time and lower cost, which was widely used in mobile phones, MP3 players, PDAs and digital cameras and other portable electronic products to provide protection and improve its reliability.




            ltem

            Standard

            Other

            Die Size Without Dicing Street

            570x270um

            NA

            Dicing Street

            60um

            No metal allowed in the dicing street

            Bump pitch

            400um within

            Follow customer requirement

            Bump Size

            120X210um

            Follow customer requirement

            Bump Height

            11um(Cu 8um+Sn 3um)

            Only Bake and no feflow allowed

            BG Thickness

            265um

            Follow customer requirement




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