国产午夜无码精品免费看,精品无码午夜福利理论片,国产成人午夜福利免费无码R

<output id="ho2oi"></output>
<code id="ho2oi"><small id="ho2oi"><track id="ho2oi"></track></small></code>

      1. <del id="ho2oi"></del>
            <tr id="ho2oi"></tr>
            <th id="ho2oi"><video id="ho2oi"><acronym id="ho2oi"></acronym></video></th>
            <object id="ho2oi"></object>

            Technology

            Hot Keywords

            Contact us

            NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

            Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

            P.O:315327

            Mail:sales@chipex.cn

            Tel:(86)-574-63078606;

                      (86)-574-63078608-8858


            Plating Solder

            Current Location: Home >> Technology >> Plating Solder

                   Electroplating solder Technology is making tin bumps on the chip pads by series processes such as coating, litho, electroplating and etching, and then using high temperature melting the bumps and been packaged, the IC size can significantly be reduced by this technology, and has a high density, low induction, low cost, good heat dissipation and so on. Wafer-level chip scale packaging is generally applicable to large-size solder balls placed on large pads and the solder technology applied in the manufacture of fine pitch and ultra-thin package of the small tin ball way. This technology successfully applied to flip and reflected its superiority.


            Solder Bump StructurePl ThicknessUBM ThicknessOther

            1M

            (UBM+Solder Bump)

            NA8um Cu+Sn

            Min.Bumo Pitch:0.15mm

            Min.Ball Size:0.08mm

            Min.Ball Height:0.020mm

            Min.PI Opening:30um

            Min.Trace Line X Space:10X10UM


            1P1M

            (PI+UBM+Solder BUMP)

            5um8um Cu+Sn

            2P2M

            (1st PI+RDL+2ndPI+

              UBM+Solder Bump)


            1st PI 5um

            2nd PI 10um

            RDL:5um Cu UBM:8um Cu+Sn

            APPlication:

            Smart Card,VCM Driver,Switch,Audio& Video,EEPROM/Flash/SRAM,MEMS&Sensor,ucontrollers


            1457924437520371.png


            a. Standard Turnkey process: Min. BG thickness 200um, T/R shipment;


            1458272849948608.jpg


            b. Special process: Min. BG thickness 60um, Wafer ring shipment.


            国产午夜无码精品免费看,精品无码午夜福利理论片,国产成人午夜福利免费无码R