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            Technology

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            NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

            Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

            P.O:315327

            Mail:sales@chipex.cn

            Tel:(86)-574-63078606;

                      (86)-574-63078608-8858


            WLCSP

            Current Location: Home >> Technology >> WLCSP

                   Wafer Level Chip Scale Packaging is different from the traditional chip package (Sawing before packaging and testing, and the volume will be increased at least 20% than the original chip). This latest technology is firstly film deposited on the wafer, then litho, electrochemical deposition, packaging and testing will be go on, at last been sawed into the same size die as the chip scale, without going through the wire and filling process, the chip size is almost the same as bare chip after packaging. Packaging efficiency close to 100%, in line with consumer electronics products’ market trend of light, small, short and thin, and has a large density, low induction, low cost, good heat dissipation and so on. The advantages of packaging are more obvious while wafer size increases and die size decreases.



            CSP Structure PI Thickness

            UBM Thickness

            Other

            1P1M

            (PI+U+CSP)

            5um/10um

            8um

            Min.Ball Pitch:0.3mm

             Min.Ball Size: 0.15mm

            Min.PI Opening:30um

            Min.Trace Line X Space:10X10um 

            2P1M

            (PI+RDL+PI+CSP)

            1st PI 5um

            2nd PI 10um

            8um

            2P2M

            (PI+RDL+PI+UBM+CSP)

            1st PI 5um

            2nd PI 10um

            RDL:5um

            UBM:8um

            3P3M

            (PI+RDL+PI+RDL+UBM+CSP)

            1st PI 5um

            2nd/3rd PI 10um

            RDL:5um

                      UBM:8um     



            Pitch

            (um)

            Product TypeBump Height(um)Bump Diameter(um)UBM Size(um)
            3001P1M/2P2M100±20180±20180
            2P1M100±20165±20160
            4001P1M/2P2M195±20270±20240
            2P1M200±20260±20210
            5001P1M/2P2M235±20320±20280
            2P1M235±20310±20240
            600
            1P1M/2P2M280±20370±20320
            2P1M280±20360±20300

                 Application:


                 IPD,PMU,Local Power,VCM Driver,Switch,Audio& Video,EEPROM,MEMS&Sensor,PA


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