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            NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

            Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

            P.O:315327

            Mail:sales@chipex.cn

            Tel:(86)-574-63078606;

                      (86)-574-63078608-8858


            CuPillar

            Current Location: Home >> Technology >> CuPillar

                Copper pillar process is making copper-tin bumps on the surface of the chip for "point-of-connection" between the chips or the chips and the substrates by utilizing gluing, litho, electroplating and etching process and other production technology through the surface of the chip in the production of copper and tin bumps after wafer processing of the substrate circuit. The array of bumps on the die surface allows pin density to be higher due to the elimination of the traditional "wire bonding" to the surrounding metal, reducing the area of the chip to meet the performance requirements of the chip, low resistance, low parasitic capacitance, low inductance, low power consumption, low signal-to-noise ratio, low cost, and so on.



            Cu-Pillar StructurePI ThicknessStandard Cu-PillarMicro Cu-Pillar

            1M

            (Dirctl Cu-Pillar)

            NA

            Pitch:150um

            Bump Size:80-100um

            Bunp Height:

            65um Cu+35um Sn

            Min.Pitch:90um

            Min.Bump Size:45um

            Bum Hemp:

            25um Cu+20um Sn

            1P1M

            (PI+Cu-Pillar)

            5um

            1P2M

            (PI+RDL+Cu-Pillar)

            5um

            2P2M

            1st PI+RDL+2ndPI+Cu-Pillar

            1st PI5um

            2ndPI 10um 



            1458266642377033.jpg

            Application:

            PMU.Smart.Card.RF.PA.MEMS&Sensor.ucontrollers.EEPROM/Dram/Flash/SRAM


            1458269032803537.jpg



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