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            Service

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            NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

            Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

            P.O:315327

            Mail:sales@chipex.cn

            Tel:(86)-574-63078606;

                      (86)-574-63078608-8858


            Service

            Current Location: Home >> Service >> Product

                  Providing wafer-level packaging services including wafer-level chip-scale packaging, plating solder, copper bump process, RDL and so on.

                  Providing variety of flip-chip packaging and packaging line including QFN, DFN, SOT, SOP, LGA and BGA, etc to the traditional packaging factories cooperated.



            A. Wafer Level Package


            未標題-1.jpg


            PackageSolder BumpPillar BumpWLCSPRDL
            Wafer Size6and 8 inch
            UBMTi/Cu
            MaterialSolderCu/Sn,Cu/SnAGLeadfreeAl,Cu,Ni/Pd/Au,Ni/Au
            Min.Pitch
            150um90um300umL/S:10/10um
            RepassivationPl,SMF,LowTem.Pl,PBO


            B. Flip Chip Package


            Package Type:LGA/BGA,QFN,DFN,SOT,SOP can be provided by ChipEx and assembly packing partners.




            C. Product Features




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